| 品牌：3M | 型号：5363 | 加工定制：否 |
| 基材：Flex to Flex, Flex to PCB | 胶系：布基胶 |
Heat cure
Fast bond time
Thermo-set high temperature cure
Excellent chemical resistance
Heat cure
Fast bond time
Thermo-set high temperature cure
Excellent chemical resistance
Highest thermal stability
Replaces solder for lead-free solution
Frozen storage
3M鈩� ACF 5363 is an epoxy-based adhesive system with 10 micron gold-coated Ni particles. It is a heat-bondable, electrically-conductive adhesive film with excellent reliability.
Additional Information
Thermoset-thermoplastic adhesive matrix randomly loaded with conductive particles. These particles allow interconnection of circuit lines through the adhesive thickness, but are spaced far enough apart for the product to be electrically insulating in the plane of the adhesive. Hard conductive particles are preferred for copper traces, as they embed into traces for good electrical performance. 3M鈩� ACF 5363 may be used to bond a flexible printed circuit to another flexible printed circuit or to a printed circuit board.
