| 品牌：3M | 型号： Tape 3305 | 加工定制：否 |
| 基材：PCB | 胶系：布基胶 |
Enables simple, low-stress, room temperature peeling of 3M鈩� Adhesives from thinned silicon wafers after glass carrier debonding
Transparency allows for inspection without tape removal
High instant adhesion to substrate
Good holding power
Enables simple, low-stress, room temperature peeling of 3M鈩� Adhesives from thinned silicon wafers after glass carrier debonding
Transparency allows for inspection without tape removal
High instant adhesion to substrate
Good holding power
3M鈩� Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M鈩� WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.
